Lead academic: Prof Lee Empringham, University of Nottingham
Universities: Loughborough and Nottingham
Research Highlights: The Heterogeneous Integration Theme aims to develop design and manufacturing methodologies to enable the integration of power devices, interconnect, passive components, EMI reducing structures and thermal management techniques in a single manufacturing process.
- Use of gel casting to create versatile magnetic core components with controllable magnetic characteristics
- Development of embedding technologies for high current power conversion
- Validation of methodologies for the creation of low inductance commutation loops for high speed switching devices
- Development of embedded structures for containment of EMI within power modules
RESEARCH OVERVIEW
To fully realise the potential of WBG technologies, new design and manufacturing approaches will be needed – from switching devices through to system level connections.
Heterogeneous Integration can be described as ‘the combination of dissimilar materials and components to create multi-featured, functional blocks or ‘systems’. This project theme will address aspects related to the inclusion of components more traditionally seen at a system level, within new and innovative power module structures.
This technology will not only reduce the problems associated with the thermal management of the system but will also create a much easier to use ‘system block’ for the designer. This should accelerate the uptake of WBG semiconductors by manufacturers by bringing added benefits such as a reduction in the use of raw materials and increased energy savings.