EPSRC Centre for Power Electronics
University of Nottingham
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 Early Career Researchers

Optimisable system-level thermal models for power electronic converters


Dr Dan Rogers, Cardiff University

This project focuses on the design of reliable yet efficient thermal models, underpinning an optimal design framework for power electronic converters. Due to the high number of times that these models must be evaluated during the optimisation process, such models are required to be of low computational cost (so-called ‘optimisable’). The project is embedded in a wider design optimisation framework, aligning with the CPE’s cross-theme topic ‘Design Tools and Modelling’.

A simplified physical model of a second order filter intended for thermal modelling is shown in Fig. 1. This, together with a set of assumptions regarding the behaviour of the heatsink, allows efficient axisymmetric modelling (Fig. 2). The project will seek to progressively increase the accuracy of the optimisable models by relaxation of the simplifying assumptions whilst ensuring a reasonable computational cost is maintained. Accuracy of the optimisable models will be assessed using much more computationally expensive three dimensional simulations.


D Rogers (Fig 1)

Fig 1.
 

 

D Rogers (Fig 2)
Fig 2.
 
 

A New Packaging Structure of Power Module with Integrated Substrate and Heat Sink

Dr Jiangfeng Li, University of Nottingham

This project proposed an innovative packaging structure of power module with integrated substrate and heat sink to improve electrical, thermal and reliability performance and reduce manufacturing cost.  The integrated substrate and heat sink was used to replace the separate ceramic-based substrate, metal-matrix composite base plate and metal heat sink, and to get rid of the large area solder joint and thermal interface material between them.  As a result, the advanced power modules constructed with this proposed packaging structure were expected to have low parasitic inductance, reduced thermal resistance and increased thermo-mechanical reliability.  A long term outcome of this work will be the provision of step change packaging structure and manufacturing process for application-specific, highly customised power electronics with high added value, which will facilitate the design and development of innovative products and manufacturing processes for the development of new energy technology.

 

 

EPSRC Centre for Power Electronics

Email: correspondence@powerelectronics.ac.uk